PacTech - Packaging Technologies - Home
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
wafer level packaging, advanced packaging equipment, WLCSP, wafer bumping, wafer level, backend, semiconductor, packaging, equipment, solder balls, pac tech, ubm, UBM, eless, NiAu, NiPdAu, solder jetting, ball drop, rework, ENIG, ENEPIG, opm, OPM, solder
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