Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microtechnologies
AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microele
high precision die bonder, high accuracy die bonder, epoxy die bonding, flip chip on lead, FCOL, automotive sensor assembly, die bonder, die bonding, flip chip bonder, flip chip bonding, wafer inking system, silicon gel dispense line system, MEMS, die att
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