AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microele
With over 500 single Bond Chambers and a total of more than 100 fully automated wafer bonding systems in the field of MEMS (Micro-Electro-Mechanical-Systems), 3D Integration, SOI (Silicon-on-insulator) and Thin Wafer Processing (Temporary Bonding and De-b
With over 500 single Bond Chambers and a total of more than 100 fully automated wafer bonding systems in the field of MEMS (Micro-Electro-Mechanical-Systems), 3D Integration, SOI (Silicon-on-insulator) and Thin Wafer Processing (Temporary Bonding and De-b
EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-mic
EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-mic
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
Caparro Enterprise can provide phone support for the following ESC Die Bonder models; 9000X, 9100LF, 9100CT, Apollo 9200 (8-inch machines), Apollo 3000 (pick and place), High Accuracy (model 5000)
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
Technologically advanced mask aligners. Incredibly fast and accurate electromagnetic linear stage motors; Smart Align Technology - superior auto alignment
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lighography (NIL), metrology, photoresist coating, cle
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.
EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, Nano and Semiconductor Industry.