EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater
EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-mic
3D Interconnect, 3D-IC, EVG, EV Group, wafer bonder, wafer bonding, bonder, bonding, semiconductor process equipment, MEMS, Advanced Packaging, aligner, mask aligner
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